Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...

The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

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TL;DR: Apple has ordered next-gen M5 chips from TSMC for iPad Pro and Macs, with production in 2H 2025. The M5 chips will use TSMC's 3nm process and SoIC technology for better thermal management, with ...

Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...

The Capital Region has become an epicenter for research and manufacturing of so-called 3D, or stackable, computer chips, a ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging technologies is ...

TL;DR: NVIDIA's B300 AI chip production is accelerated to May, utilizing TSMC's advanced 5nm N4P process and CoWoS-L packaging. Featuring Bianca compute boards with 1 CPU and 2 GPUs, the B300 aims to ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...