Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

Join members of the development team for a look at Operencia from a Design and 3D level building perspective as they discuss how a level comes to life, and more. Operencia: The Stolen Sun will be ...

Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products. It is a continuous challenge to meet targets of both yield and cost, due to new device ...

Sony Electronics is enhancing immersive 3D experiences, adding the NVIDIA Omniverse development platform to its ELF-SR2 (27-inch) and ELF-SR1 (15.6-inch) Spatial Reality Displays. The combination with ...

Crafting 3D models presents various hurdles, including resource constraints, tight timelines, and collaboration gaps within teams. The intricacies of texturing and animating further extend the time ...